Cupping test machine ・Elysen test machine
The cupping test machine is a testing device used to evaluate the resistance to cracking and delamination from the metal substrate when the coating film undergoes localized deformation due to indentation.
The cupping test machine is a testing device that evaluates the resistance to cracking and peeling from the metal substrate when the coating film undergoes localized deformation due to indentation. It is equivalent to the Erichsen testing machine specified in JIS-K5400. By attaching the included small CCD camera, the testing process is displayed on this liquid crystal touch panel display screen. Video recording and image capture can be performed via touch operation, and the data can be saved to a USB memory stick for transfer to a computer. The indentation speed and depth can be freely adjusted and saved. Automatic calibration can be performed using the included calibration zero plate. As a fully automatic type, the test begins with the press of a button. Indenter: hemispherical with a diameter of 20mm; indentation depth: 0-15mm; indentation speed: 0.02-0.4mm/s; maximum test panel width: 70mm; test panel thickness: up to 1.25mm for steel plates and up to 3mm for aluminum.
- Company：オールグッド
- Price：500,000 yen-1 million yen
